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Disco Dad 320
Automatic Dicing Saw


Dicing Saw
13-11 Omori-Kita 2-chome, Ota-ku, Tokyo 143-8580 Japan
Overseas Sales Department
Phone: 81-3-4590-1100Fax: 81-3-4590-1075
http://www.disco.co.jp/eg/products/dicer/300.html

Contact Information:
  Faculty Contact:   Aaron Hawkins
  Staff Contact:   Joe Bussio
  Student Contact:   Sadek Sabbah

Maintenance Request for Dicing Saw


NOTE:
  • Currently only blades for silicon and glass are available. For other materials, seek the assistance of the lab technician.
  • Questions: Contact the student contact first before going to the Staff or Faculty contact
  • Never operate the high vacuum (TURBO) pump without the roughing (MECH) pump being on

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  1. General Description
    1. A Dicing Saw is used to cut(or dice) or groove semiconductor wafer into small square, or die. The Dicing saw equiped with a high speed spindle with an ultra thin diamond blade (or diamond saw) to dice the wafer into particular sizes. The image below decribe the general purpose of the dicing saw:
      (image source from www.disco.co.jp)

  2. Operating Instructions
    1. Starting up the necessary equipment
      1. Turning on the Machine:
        1. Before doing anything make sure the air and the water are turned on. These are found to the right of the machine, and the valves are show in the figure be1ow.
      2. Turn the ignition key to the right
      3. After turning the machine on, the Main Menu screen should be displayed.
    2. The Key Panel
      1. Most of the interaction with the dicing saw is done through the key pad shown in the figure below. For convenience, a coordinate system was placed on the top and left of the keypad so that the position of the keys can be easily described in these instructions for example; the “7” key would be denoted as 7 key (Al).
    3. Initialization and Setup
      1. WARNING: If the following steps are not followed, the machine will not initialize properly, and the blade may explode upon contact with the wafer chuck
      2. Press the SYS INIT key (H4). The machine will then run through some automatic adjustments and checks.
        1. Once finished, the screen will display “Initialization Completed” in the bottom left corner of the machine.
      3. Press the SET UP key (H3). The setup screen should appear. Verify the Blade O.D. is 2.18700 inch and the Chuck Table Size is 6 inch, then press the Enter key (C4). The machine will go through several adjustments and tests.
      4. Press the Exit key (E1).
      5. The Main Menu screen should be displayed.
      6. If there is an error in the setup process, the machine will not run. Possible causes of an error may include a chipped unclean blade.
        1. In the event of a chipped blade, the blade will need to be replaced following the procedures listed in this instruction page.
        2. If the blade is not chipped try running the water for a moment by pressing the Water key (J4) and then run the setup again from the beginning.
        3. If neither of these solutions works, refer to the user’s manual or seek the help of the lab technician.
    4. Running the Machine
      1. Device Data List
        1. Press the F3 key (J1) to go to the Device Data List.
        2. Enter the device number in the “Select Device Data” field and then press Enter (C4). If you know the pre-recorded program, select that from the list, otherwise use 100 and input all of the data on the next screen.
        3. The Device Data (1) screen should then appear. This is the screen where many important parameters will be entered.
      2. Dicing Saw Program Table
        1. The following Dicing Saw Program Table shows the Field Name, and the corresponding standard Value for the field. Go through each item and make sure that they are correct. When adjusting the work thickness, set it at about .05 to .1 mm less than the actual thickness of the wafer you are trying to cut so as to ensure that the blade does not cut into the base and chip the blade.
      3. Y-Index
        1. The Y index will be the distance between each cut. If that is not predetermined, this parameter can be used to jump a specified distance on the screen to make aligning the cut a little easier. When you have input all of the parameters, move to the Final Steps.
    5. Final Steps before Cutting
      1. The sample must be vacuumed down on the chuck, so the C/T Vac key (L4) must be pressed. This key is quite worn on our particular machine.
      2. Press it and the vacuum gauge should show that it is under vacuum.
      3. s_auto from the Device Data Screen. This is done by pressing the F7 key (I2).
      4. A different screen should appear.
      5. Use the x, y, and theta keys, align the wafer to be cut.
        1. The dotted lines across the screen may be used to align the angle, however as the blade isn’t spaced properly they do not indicate the location of the cut. For an approximate location, the top of the screen can be used for alignment. For a precise cut, set both of the Y index values to .2546 and then on the screen, align the cut location to the middle line and move one index down so that now your cut location is near the top of the screen, and you will get an accurate cut. For precise cuts, you will be unable to make more than one cut at a time as you will need to align each manually.
      6. Once the alignment has been set, specify the number of cuts that you would like it to make. For multiple cuts, the machine will automatically move the distance specified by the Y index between each cut.
      7. The last positioning key pressed before cutting must be the underlined theta key going in the clockwise direction (M3) and the Y direction key that moves the sample up (M4).
        1. This will free up the motor, and if it isn’t done, there will be a warning instructing the user to press the keys before cutting. (The machine won’t register they’ve been pressed if done while the index key light is on).
      8. Select the Rear option by pressing the F5 key (L1).
      9. Press the Cut/Water key (J4) to start cooling the spindle.
      10. Position the Sample to the desired cut location using the position keys; then press the Start/Stop key (G1) to make the cut. Press it again after the cut is made.
      11. Reposition the sample and continue cutting by pressing the Start/Stop key.
        1. Using the Index key (02) you can move the sample the designated index space between cut locations. You can also rotate the wafer 90 degrees by making sure the index key is pressed and rotating right.

  3. The Measure Menu
    1. Mannually Measure Y-Index Channel
      1. To manually measure the Y Index channels, you can access the Measure Menu by pressing the F8 key. This can be used to determine the y indices that are entered in the Data Device Screen, and will be used in cutting the sample.
    2. Display Pattern on the Sample
      1. To see the pattern on the sample, press the Display Mode key (J3). This will toggle between 4 different viewing modes.
      2. Use the left and right theta rotation key to get the line on the screen to be parallel with the pattern on the wafer that defines that die size.
      3. Position the line onto the pattern using the x and y keys (M2, N2, M4, & N4), then position the cursor to the desired index field using the Arrow Keys (F2, E3, G3, & F4).
      4. Press F5 (L1) to copy the current position to that index field.
      5. Press the Index key (02), and a red LED should turn on above that key.
      6. Now, by pressing the Y keys, the sample should move up the set amount. The index can be adjusted manually if needed. Press the index key again when finished to disable it.
      7. When the index is set correctly, press the F1O (L2) key and it will set the data in the Data Device Screen for the selected Y Index Channel.
      8. Then, select the other channel and rotate the sample 90 degrees and do the same thing for that direction.
      9. Press the Exit key (El) to return to the Data Device Screen, if not already there.

  4. Shut Down Instruction
    1. Ensure that the spindle has been turned off and then turn the ignition key off.
    2. Turn off the gas and water.

  5. Questions
    1. For any questions you may have regarding the operation of the machine, beyond what is herein specified, consult the manual or contact Phil Brown.

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