BYU Home page BRIGHAM YOUNG UNIVERSITY  
Search the Cleanroom:
Home   |   Contact   |   Site Map
Navigation Menu




Physical Vapor Deposition

Metal deposition

Expand All Compress All The expand-all feature is useful when searching for a specific term.
  1. E-Beam Evaporation

  2. Filament Evaporation

  3. Sputtering

  4. Alloys

  5. Uniformity and Deposition Rate

  6. Step Coverage

  7. Tips for High Deposition Rates

  8. Quartz Monitor

  9. Vacuum Pumps



 
 

Summary of Pros and Cons to evaporation methods



Method Pro Con
E-Beam Evaporation 1. high temperature materials
2. good for liftoff
3. highest purity
1.  some CMOS processes sensitive to radiation
2. alloys difficult
3. poor step coverage
Filament Evaporation
1. simple to implement
2. good for liftoff
1. limited source material (no high temperature)
2. alloys difficult
3. poor step coverage
Sputter Deposition
1. better step coverage
2. alloys
3. high temperature materials
4. less radiation damage
1. possible grainy films
2. porous films
3. plasma damage/contamination

For details on common materials, liners, melting points, etc. see Thin Film materials reference.

For information on semiconductor substrates, see this link.
For thermal properties of pure metals see this link.

Equipment



  1. References



Comments or suggestions? Submit them here.

Maintained by ECEn IMMERSE Web Team.
Copyright © 1994-Present. Brigham Young University. All Rights Reserved.