Photoresists & Manufacturers

AZ Electronic Materials
Dow
DuPont
Electra Polymers Ltd.
Eternal Chemical
Fujifilm Electronic Materials
Hitachi Chemical
HiTech Photopolymere AG
JSR Micro
Kolon Industries
MacDermid
MicroChem
Rohm and Haas (subsidiary of Dow)
Sumitomo Chemical
Tokyo Ohka Kogyo Co., Ltd.

Manufacturer	Photoresist	Tone	Thickness (in µm)	Exposure Wavelengths (in nm)	Aspect Ratio/ Resolution	Primary Uses/Applications
AZ	AX series			193		contact holes, line/space
AZ	DX and EXP series			248		multi-purpose, back end
AZ	HiR 1075	Positive	0.6-1.2	i	Ultra high	line/space, contact holes
AZ	MiR 701	Positive	0.6-3.0	i	High	line/space, contact holes
AZ	MiR 703	Positive	0.8-1.4	i	Mid-range	line/space, contact holes
AZ	MiR 900	Positive	2-4.5	i	High aspect ratio	line/space
AZ	N6000	Negative	0.6-10	i		ion implant, high speed
AZ	nLOF 2000	Negative	1.5-10	i		lift off
AZ	nLOF 5000	Negative	0.75-1.5	i	High	lift off
AZ	3300	Positive	1-2.5	ghi		general purpose
AZ	3300-F	Positive	0.8-5	ghi		general purpose, high speed
AZ	1500	Positive	0.4-4	ghi		general purpose, wet etch
AZ	N4000	Negative	2.5-5.5	gh
AZ	P4000 series	Positive	2-55	gh	2:1
AZ	4500 series	Positive	2-55	gh	2:1
AZ	9200 series	Positive	3-50	ghi	3:1
AZ	10XT	Positive	4-50	ghi	3:1	plating and etch applications
AZ	50XT	Positive	15-65	gh	3:1	plating and etch applications
AZ	PLP-30		6-25	gh	2:1
AZ	PLP-40		20-30	gh	2:1
AZ	5XT series	Positive	3-5	ghi	2:1
AZ	12XT series	Positive	5-20	ghi	4:1	Cu RDL and TSV applications
AZ	40XT series	Positive	20-100	ghi	4:1	etch and plating applications
AZ	125nXT series	Negative	20-120	ghi	6:1
AZ	5nXT/15nXT	Negative	5-20	ghi	3:1	Cu RDL and TSV plating/etch
AZ	TX 1311		3-5	DUV	15:1
DOW	Laminar series					dry film photoresists for alkaline and acid etch and pattern plating
DOW	Eagle 2100 ED	Negative				printed circuit board manufacturing
DOW	Photoposit series					roller coated photoresists for printed circuit boards
DOW	Epic 2135			193		65 nm and 90 nm node processes
DOW	UVN 2300	Negative		DUV		implant and cell open applications
DOW	UV series	Positive	0.5-3	248
DOW	MCPR i7010N	Positive	>0.35	i		general purpose
DOW	Megaposit SPR 955-CM	Positive	>0.35	i		general purpose
DuPont	Riston Etchmaster 213/830	Negative	30	350-380		dry film resist, acid etch, chemical milling
DuPont	Riston Goldmaster GM100		50/75/100	350-380		dry film resist, gold plating, adhesion to various metals
DuPont	Riston MultiMaster MM100i/MM500		30/40/50/65/75	350-380		dry film resist, general purpose, alkaline etch, gold plating
DuPont	Riston PlateMaster PM200/PM300	Negative	38/40/50/75/100	350-380		dry film resist for copper, tin, tin/lead plating
DuPont	Riston TentMaster TM200i	Negative	30/38	350-380		dry film resist, tent and etch processes, acid etch
DuPont	Riston Laser LDI 300/500/7000/7200/8000	Negative	30/38/40/50/62/75	355/405		dry film resist, laser direct imaging
DuPont	Riston FX 250/500/900	Negative	15,30,40,50,62	350-380		dry film resist, Ni/Au plating, fine lines, chemical milling, acid etch
Eternal	Etertec Series		12-50			dry film resists, plating, print-and-etch, tent-and-etch, chemical milling, PKG
Eternal	Laminar Series		24-101			dry film resists, plating, print-and-etch, tent-and-etch, LDI for some
Fujifilm	FEP-100	Positive		e-beam		e-beam direct write
Fujifilm	FEN-100	Negative		e-beam		e-beam direct write
Fujifilm	GAR series			193		various
Fujifilm	GKR series			248		various
Fujifilm	SC series	Negative	>1	g		general purpose, resistant to common silicon etchants
Fujifilm	HNR series	Negative	>1	g
Fujifilm	HR series	Negative	>1	g
Fujifilm	IC series	Negative	>1	g
Fujifilm	HPR 500 series	Positive	>0.75	g		ion implant, wet and dry etching
Fujifilm	OCG 825		>0.75	g
Fujifilm	HiPR 6500 series		>0.75	gi
Fujifilm	OiR series	Positive	>0.25	gi		various
Fujifilm	FHi series		>0.25	gi
Fujifilm	GiR 1102		0.25-0.4	i
Fujifilm	PMMA	Positive		DUV/e-beam	7:1	various
Hitachi	RD series		10/15/20/25	355-405	High	dry film, DLP and UV-LDI systems
Hitachi	DL series		29/32/38		High	dry film, DLP systems
Hitachi	SL series		29/33/38		High	dry film, UV-LDI systems
Hitachi	RY series		25		High	dry film, PKG
Hitachi	H series		25/30/34/38/45		High	dry film, PCB production, tenting
Hitachi	HM series		56/75/112		High	dry film, electro-forming
Hitachi	FR series		25/38/50			dry film, FPC production
Hitachi	FZ series		20/25/30/35			dry film, solder resist, PKG
HiTech	DiaEtch 101	Negative		300-350		Dip-coating application for various metallic substrates
HiTech	DiaEtch 102	Negative	>25	300-450		Dip-coating application for printed circuit boards
HiTech	DiaEtch 120	Negative	>25	300-450		Roller-coating application for printed circuit boards
HiTech	DiaEtch 122	Negative	>25	300-450		Roller-coating application for various metallic substrates
HiTech	DiaPlate		5-500			Electroforming process, adhesion to various substrates
JSR Micro	ARX series	Positive		ArF(193)		line/space, contact hole, implant
JSR Micro	M series	Positive		KrF(248)		line/space, contact hole, implant
JSR Micro	V series	Positive		KrF(248)		implant
JSR Micro	NDS series	Negative		KrF(248)		implant
Kolon	Trumask	Negative				inner layer, lead frames, BGA, roller or dip-coated
MacDermid	Microtrace
Microchem	PMGI and LOR	Positive	<0.05 - >8	DUV/240-290		Sacrificial Layer, Bi-layer Lift-off
Microchem	SU-8 series	Negative	<1 - >300	Near UV/350-400	10:1	Permanent applications
Microchem	KMPR 1000	Negative	<4 - >120	i	High	MEMS, electrolytic plating, DRIE applications
Microchem	PMMA	Positive	<0.1 - >5	DUV/e-beam/x-ray	High	T-gates, e-beam and x-ray processes, protective coatings, sacrificial layer
Sumitomo	Sumiresist	Positive

*g=436 nm h=405 nm i=365 nm